Advanced printed circuit board reliability test facility Concept Note (Equipment)
Principal Investigator
Prof. Anbarasu Manivannan
Objective
- Establish various labs for PCB reliability assessment, design analysis, and testing, including SMT processes, thermal stress analysis, and solder joint evaluation, Additionally, offer PCB Assembly testing services to industries
Description
- Physics of Failure (PoF) ? a science-based design-for-reliability approach predicting and preventing product failures by examining root-cause mechanisms, product requirements, physical traits, manufacturing variations, and stressor impacts ? forms the foundation of this IIT Madras initiative. By establishing a PoF-based Advanced PCB Reliability Centre offering PCBA testing, SMT evaluation, thermal stress analysis, and design reliability assessment, the project supports electronics manufacturers and R&D institutes, reduces product failure rates, and builds a resilient high-tech ecosystem for India.
Impact
- Establishment of Test facilities for Physics of Failure (PoF) based Reliability Innovation Centre at IIT Madras to cater the need of PCBA reliability test on various types of PCBs for both R&D Institutes as well as Electronics Manufacturing Industries
Budget in Lakhs
680.00
Duration
4 years