IIT Madras Advanced PCB Reliability Test Facility: CSR Partnership for Electronics Innovation

Advanced printed circuit board reliability test facility

Objective

• Establish various labs for PCB reliability assessment, design analysis, and testing, including SMT processes, thermal stress analysis, and solder joint evaluation, Additionally, offer PCB Assembly testing services to industries

Description

• Physics of Failure (PoF) ? a science-based design-for-reliability approach that predicts and prevents product failures by examining root-cause mechanisms and relationships among product requirements, physical traits, manufacturing variations, and stressors ? forms the foundation of this IIT Madras initiative. The project establishes a PoF-based Reliability Innovation Centre offering PCBA reliability testing, thermal stress analysis, SMT evaluation, and design analysis for SMEs, R&D institutes, and electronics manufacturers, strengthening India's electronics ecosystem and building long-term capability in reliable, failure-resistant product innovation.

Impact

• Establishment of Test facilities for Physics of Failure (PoF) based Reliability Innovation Centre at IIT Madras to cater the need of PCBA reliability test on various types of PCBs for both R&D Institutes as well as Electronics Manufacturing Industries