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Advanced Packaging Facility for the Indian Semiconductor Ecosystem at IIT Madras

Advanced packaging facility to support the indian semiconductor ecosystem

Advanced packaging facility to support the indian semiconductor ecosystem

Principal Investigator

Prof. HOD - Interdisciplinary Studies

Objective

  • Establish a state-of-the-art advanced 2.5D/3D heterogenous packaging facility at IIT Madras, Develop indigenous technologies for substrates, interposers, bonding, and reliability processes, Demonstrate in-house technology readiness through prototype power, photonic, and RF modules, Build advanced co-design and system optimization frameworks for performance and reliability, Create comprehensive testing, thermal, and reliability infrastructure for package qualification, Foster collaborations with industry, ISM, and MeitY for technology translation and ecosystem growth, Provide hands-on training and workforce development in advanced packaging technologies for a sustainable skilled ecosystem, Support Atmanirbhar Bharat and the India Semiconductor Mission through indigenous innovation and self-reliance

Description

  • The objective is to establish a state-of-the-art advanced heterogenous 3D packaging facility at IIT Madras to support the semiconductor ecosystem & to support Atmanirbhar Bharat and the India Semiconductor Mission through indigenous innovation and self-reliance.

Impact

  • Generation of a trained workforce in semiconductor fabrication, packaging and assembly, with hands-on training programs for engineers, diploma holders and ITI graduates in key fabrication processes, semiconductor packaging, SMT assembly and microfluidic devices, Training of 10,000 personnel over seven years, supporting the ramp-up of semiconductor fabrication and OSAT facilities within the country, Highly trained PhD, MS and MTech students in design, modeling/simulation, manufacturing processes and testing/reliability who can lead or accelerate projects of participating industries, Shared infrastructure access for prototyping, testing, and materials validation - capabilities typically inaccessible to MSMEs due to high capital cost, Enabling startups in chip design, packaging tools, materials, and power electronics to validate and scale their technologies domestically, Supporting MSMEs in Tamil Nadu and across India that supply precision components, automation tools, process materials, and specialized equipment

Budget in Lakhs

11500.00

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